You have to identify the oven recipe that processes the board within the tolerances required by the chosen solder paste, components, and substrate. The fundamental reflow process for a MCPCB is the same as for a FR4 PCB. Dixon's electronics industry experience includes a broad skill set that includes engineering, field service, applications, product management and marketing communications expertise. As an electronics veteran, Dixon has worked in the industry for over 30 years for companies like Henkel, Universal Instruments, Camelot Systems, and Raytheon. 360 BC specializes in consulting and implementing successful marketing programs that utilize the latest in marketing, sales and technology strategies. 200 centigrade can help to start the cooling process.ĭouglass Dixon is the Chief Marketing Officer for 360 BC Group, a marketing agency with offices throughout the US. Reducing the temperature in the last zone to approx. Maybe you should use the last zone if you have enough reflow zones to start the cooling process. Generally, more energy at the start of the reflow profile will heat the PCB more quickly. Therefore, care has to be taken with heat sensitive components to ensure they are not damaged. However, once it is heated up, it stores the hot for a longer time. Due to the mass of metal, it normally takes more energy to warm up the circuit boards in the oven, so more energy may be required at the early stage to heat up the board. These offer a number of interesting differences to normal PCBs during reflow. I assume that with metal core, we are looking at very heavy PCBs. We have never processed MCPCBs before and I would be grateful for any useful advice? How does the reflow process for a MCPCB (metal core PCB) differ from a FR4 laminate PCB?
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